The Microdisplays and Sensors business unit at the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP will be integrated into the Fraunhofer Institute for Photonic Microsystems IPMS with retroactive effect from January 1, 2024.
As part of the Waste4Future flagship project, eight Fraunhofer institutes are developing new ideas and processes to significantly improve the mechanical recycling rate for plastic materials.
Researchers at Fraunhofer USA, an independent international affiliate of the Fraunhofer-Gesellschaft, have succeeded in developing wafer-thin nanomembranes from synthetic diamonds that can be integrated into electronic components
Researchers at Fraunhofer have recently developed a process that allows to utilize keratin for this purpose.